Characterization of embedded passives using macromodels in LTCC technology

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 3, 1998, Pages 258-268

  Choi, Kwang Lim ^b   Na, Nanju ^b   Swaminathan, Madhavan ^a,b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Embedded passives; Interpolation technique; Macromodeling; Multilayered packaging; Portable wireless

Indexed keywords

COMPUTER SIMULATION; ELECTRIC LOSSES; ELECTRONICS PACKAGING; FREQUENCY DOMAIN ANALYSIS; INTERPOLATION; TIME DOMAIN ANALYSIS; VOLTAGE DIVIDERS;

LOW TEMPERATURE CO FIRED CERAMIC (LTCC) TECHNOLOGY; TIME DOMAIN REFLECTOMETRY/TIME DOMAIN TRANSMISSION (TDR/TDT);

PASSIVE NETWORKS;

EID: 0032138546     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.704936     Document Type: Article

References (11)

1. A. Ruehli, "Partial element equivalent circuit (PEEC) method and its application in the frequency and time domain," in IEEE Int. Symp. Electromagn. Compat., 1996, pp. 128-133.
2. SONNET User's Manual, SONNET Software, Inc., vol. 1, Sept. 1996.
3. D. G. Swanson, "Simulating EM fields," IEEE Spectrum, pp. 34-37, Nov. 1991.
4. K. L. Choi and M. Swaminathan, "Utilization of fast algorithm to analyze embedded passive components using commercial EM solvers," in IEEE 6th Topical Meeting Elect. Perf. Electron. Packag., Oct. 1997, pp. 240-243.
5. K. Kottapalli, T. Sarkar, Y. Hua, E. Miller, and G. Burke, "Accurate computation of wide-band response of electromagnetic systems utilizing narrow-band information," IEEE Trans. Microwave Theory Tech., vol. 39, pp. 682-688, Apr. 1991.
6. R. Adve, T. Sarkar, S. Rao, E. Miller, and D. Pflug, "Application of the Cauchy method for extrapolating/interpolating narrow-band system responses," IEEE Trans. Microwave Theory Tech., vol. 45, pp. 837-845, May 1997.
7. C. Huang, M. Celik, and J. L. Prince, "Simultaneous switching noise simulation for thin film packages using macromodeling technique," in Proc. Electron. Comp. Technol. Conf., 1996, pp. 747-751.
8. A. Cangellaris and J. Prince, "Modeling and simulation for mixed-signal package design," Adv. Electron. Packag., vol. 19, no. 1, pp. 497-507, 1997.
9. V. Raghavan, R. A. Rohrer, L. T. Pillage, J. Y. Lee, J. E. Bracken, and M. M. Alaybeyi, "AWE-inspired," in Proc. IEEE 1993 Custom Integrated Circuits Conf., 1993, pp. 18.1.1-18.1.8.
10. N. Na, K. L. Choi, and M. Swaminathan, "Characterization of embedded resistors for high frequency wireless applications," in IEEE Radio Wireless Conf., Colorado Springs, CO, Aug. 1998.
11. A. Sood, K. L. Choi, A. Haridass, N. Na, and M. Swaminathan, "Modeling and mixed signal simulation of embedded passive components in high performance packages," in Proc. MCM'98 Conf., Denver, CO, Apr. 1998, pp. 506-511.