Modeling and mixed signal simulation of embedded passive components in high performance packages

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 506-511

  Sood, A ^a   Choi, K L ^a   Haridass, A ^a   Na, N ^a   Swaminathan, M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC SIMULATION; EQUIVALENT CIRCUITS; MICROELECTRONICS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; TEMPERATURE;

DESIGN ENVIRONMENT; ELECTROMAGNETIC SIMULATORS; EMBEDDED CAPACITOR; EMBEDDED PASSIVE COMPONENTS; HIGH-PERFORMANCE PACKAGES; LOW TEMPERATURE COFIRED CERAMIC TECHNOLOGIES; MIXED-SIGNAL SIMULATION; TIME DOMAIN MEASUREMENT;

SPICE;

EID: 0002455506     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670832     Document Type: Conference Paper

References (4)

1. Kwang Lim Choi and Madhavan Swaminathan, "Utilization of Fast Algorithm to Analyze Embedded Passive Components Using Commercial EM Solvers", Topical Meeting on Electrical Performance Packaging, San Jose, Oct 97.
2. Kwang Lim Choi, Nanju Na, and Madhavan Swaminathan, "Macromodeling and Simulation of Embedded Passives in High Performance Packages", Submitted to IEEE Transactions on Component, Packaging, and Manufacturing Technology Jan 97.
3. Nanju Na, Kwang Lim Choi, and Madhavan Swaminathan, "Characterization of embedded resistors for high frequency wireless applications", Submitted to IEEE RFlC Symposium, June 98.
4. Kwang Lim Choi and Madhavan Swaminathan, "Synthesis of RF Circuits Using Embedded Passive Components for Mixed Signal Applications", To be submitted to Electronic Components and Technology Conference, Feb 98.