The effects of material properties on heat dissipation in high power electronics

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 3, 1998, Pages 280-289

  Lu, T J ^a   Evans, A G ^b   Hutchinson, J W ^b  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ENERGY DISSIPATION; HEAT CONVECTION; MATHEMATICAL MODELS; OPTIMIZATION; SUBSTRATES;

HEAT DISSIPATION;

MICROELECTRONICS;

EID: 0032166541     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792634     Document Type: Article

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