Wirebonding to multilevel metal

Solid State Technology

Volumn 40, Issue 11, 1997, Pages 87-97

  O'Neill, Peter M ^a,b,c   Eaton, Dennis H ^a,d,e   Phua, Thomas ^a,f,g   Loh, Frankie ^a,g,h,i   Chin, Bernard ^a,g,j  

^a HEWLETT PACKARD COMPANY   (United States)

^b PURDUE UNIVERSITY   (United States)

^c MS 64 ^*  (United States)

^d HARVEY MUDD COLLEGE   (United States)

^e UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^f UNIVERSITY OF TEXAS   (United States)

^g Hewlett Packard Singapore (Private) Limited   (Singapore)

^h TEXAS A AND M UNIVERSITY   (United States)

ⁱ Integrated Circuit Business Division

^j UNIVERSITY AT BUFFALO   (United States)

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Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042111493     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (9)

1. T. Ramsey, C. Alfaro, H. Dowell, "Metallurgy's Part in Gold Ball Bonding: Information You Can Use to Assess Gold-to-Aluminum Bond Quality and Reliability," Semiconductor International, April 1991, pp. 98-102.
2. H. Ueno, "Influence of Al Film Thickness on Bondability of Au Wire to Al Pad," Materials Transactions, JIM, Vol. 33, No. 11, 1992, pp. 1046-1050.
3. H. Ueno, "Reliable Au Wire Bonding to Al/Ti/Al Pad," Japanese Journal of Applied Physics, Vol. 32, Part 1, No. 5A, May 1993, pp. 2157-2161.
4. "Test Methods for Destructive Shear Testing of Ball Bonds," ASTM F 1269-89, 1995.
5. "Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds," ASTM F 459-84, 1995.
6. Y-S. Chen, H. Fatemi, "Au Wire Bonding Evaluation by Fractional Factorial Designed Experiment," Proc. 1986 Internatl. Symposium on Microelectronics, pp. 76-82.
7. ECHIP: Software for Statistically Designed Experiments, ECHIP Corp., Yorklyn Rd., Hockessin DE 19808.
8. R.A. Clark, V. Lukatela, "Inadequacy of Current MIL-STD Wire Bond Certification Procedures Applied to Au-Al Ball Bonds," The International Journal of Microcircuits and Electronic Packaging, Vol. 15, No. 2, Second Quarter 1992, pp. 87-96.
9. G.V. Clatterbaugh, H.K. Charles, Jr., "The Effect of High-temperature Intermetallic Growth on Ball Shear-induced Cratering," Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13., No. 1, March 1990, pp. 167-175.