Mechanical stress evolution and the blech length: 2D simulation of early electromigration effects

Microelectronics Reliability

Volumn 38, Issue 6-8, 1998, Pages 1047-1050

  Petrescu, V ^a   Mouthaan, A J ^a   Schoenmaker, W ^b   Salm, C ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC RESISTANCE; ELECTROMIGRATION; STRESSES;

BLECH LENGTH;

MICROELECTRONICS;

EID: 0032083683     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00105-X     Document Type: Article

References (5)

1. I.A. Blech, J. Appl. Phys. 47, 1976, pp 1203.
2. M.A. Korhonen, S. Rzepka, R.G. Filippi, C.-Y. Li, Proc. of the Fourth Int. Workshop in Stress Induced Phenomena in Letallization, 1997, pp 303.
3. J.J. Clement, C.V. Thompson, J. Appl. Phys. 78 (2), 1995, pp. 900.
4. N.L. Beverly, G.B. Alers, J.A. Prybyla, Appl. Phys. Lett. 68 (17), 1996, pp. 2372.
5. R.G. Filippi, G.A. Biery, R.A. Wachnik, J. Appl. Phys. 78 (6), 1995, pp. 3756.