High performance etching process for organic films using SO2/O2 plasma

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 4 SUPPL. B, 1998, Pages 2369-2372

  Ohkuni, Mitsuhiro ^a   Kugo, Shunsuke ^a   Sasaki, Tomoyuki ^a   Tateiwa, Kenji ^a   Nikoh, Hideo ^a   Matsuo, Takahiro ^a   Kubota, Masafumi ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

Bottom anti reflective coating; Dry development; Etching; O2; Radical shading effect; SO2; Vpp

Indexed keywords

ANISOTROPY; ANTIREFLECTION COATINGS; AUGER ELECTRON SPECTROSCOPY; DEPOSITION; DRY ETCHING; SULFUR DIOXIDE;

CRITICAL DIMENSION (CD) CONTROLLABILITY; FIELD EMISSION AUGER ELECTRON SPECTROSCOPY (FEAES) ANALYSIS; INDUCTIVELY COUPLED PLASMAS (ICP);

PLASMA ETCHING;

EID: 0032050771     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.2369     Document Type: Article

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