Liquid Jet-Array Cooling Modules for High Heat Fluxes

AIChE Journal

Volumn 44, Issue 4, 1998, Pages 769-779

  Oh, Chang H ^a   Lienhard V, John H ^b   Younis, Hesham F ^b   Dahbura, Rudy S ^b   Michels, Dirk ^b  

^a Lockheed Martin Idaho Technology Company   (United States)

^b Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT CONVECTION; HEAT FLUX; HEAT RESISTANCE; JETS; STRESS ANALYSIS; THERMAL LOAD; THERMAL STRESS;

LIQUID JET ARRAY MODULES;

COOLING SYSTEMS;

EID: 0032048326     PISSN: 00011541     EISSN: None     Source Type: Journal    
DOI: 10.1002/aic.690440402     Document Type: Article

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