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Volumn 9, Issue 2, 1998, Pages 109-113
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Diffusion barriers in gold-metallized titanium-based contact structures on SiC
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Author keywords
[No Author keywords available]
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Indexed keywords
DECOMPOSITION;
DIFFUSION IN SOLIDS;
ELECTRIC CONTACTS;
ELECTRIC RESISTANCE;
GOLD;
INTERFACES (MATERIALS);
METALLIZING;
MORPHOLOGY;
PHASE EQUILIBRIA;
SCANNING ELECTRON MICROSCOPY;
THERMAL STRESS;
TITANIUM;
DIFFUSION;
HIGH TEMPERATURE EFFECTS;
PALLADIUM;
SILICON CARBIDE;
STRUCTURE (COMPOSITION);
THERMODYNAMIC STABILITY;
TITANIUM COMPOUNDS;
CONTACT STRUCTURES;
DIFFUSION BARRIERS;
METALLIZATION;
ELECTRICAL CHARACTERIZATION;
HIGH TEMPERATURE STABLE CONTACT SYSTEMS;
TITANIUM BASED CONTACT;
SILICON CARBIDE;
ELECTRIC CONTACTS;
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EID: 0032047819
PISSN: 09574522
EISSN: None
Source Type: Journal
DOI: 10.1023/A:1008805305059 Document Type: Article |
Times cited : (10)
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References (8)
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