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Volumn 9, Issue 2, 1998, Pages 109-113

Diffusion barriers in gold-metallized titanium-based contact structures on SiC

Author keywords

[No Author keywords available]

Indexed keywords

DECOMPOSITION; DIFFUSION IN SOLIDS; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; GOLD; INTERFACES (MATERIALS); METALLIZING; MORPHOLOGY; PHASE EQUILIBRIA; SCANNING ELECTRON MICROSCOPY; THERMAL STRESS; TITANIUM; DIFFUSION; HIGH TEMPERATURE EFFECTS; PALLADIUM; SILICON CARBIDE; STRUCTURE (COMPOSITION); THERMODYNAMIC STABILITY; TITANIUM COMPOUNDS;

EID: 0032047819     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008805305059     Document Type: Article
Times cited : (10)

References (8)
  • 2
    • 0029521355 scopus 로고    scopus 로고
    • F. GOESMANN and R. SCHMID-FETZER, Semicond. Sci. Technol 10 (1995) 1652 and 11 (1996) 461.
    • (1996) Semicond. Sci. Technol , vol.11 , pp. 461
  • 7
    • 25044442854 scopus 로고
    • Dissertation, University Regensburg
    • M. MÄNDL, Dissertation, University Regensburg (1991).
    • (1991)
    • Mändl, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.