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Volumn 9, Issue 2, 1998, Pages 103-107
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Metallization studies on Ti3SiC2-based contacts on 6H-SiC
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
ELECTRIC RESISTANCE;
GOLD;
METALLIC FILMS;
METALLIZING;
MORPHOLOGY;
PALLADIUM;
SILICON CARBIDE;
STRUCTURE (COMPOSITION);
THERMAL STRESS;
THERMODYNAMIC STABILITY;
TITANIUM COMPOUNDS;
ANNEALING;
ELECTRIC CONTACTS;
ELECTRIC PROPERTIES;
THIN FILMS;
TITANIUM;
ALUMINUM FILMS;
CONTACT STRUCTRES;
MORPHOLOGICAL CONTACT PROPERTIES;
TITANIUM BASED ELECTRIC CONTACTS;
CONTACT STRUCTURES;
METALLIZATION;
ELECTRIC CONTACTS;
SILICON CARBIDE;
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EID: 0032050531
PISSN: 09574522
EISSN: None
Source Type: Journal
DOI: 10.1023/A:1008853220989 Document Type: Article |
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Times cited : (10)
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References (10)
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