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Volumn 5, Issue 2, 1998, Pages 245-249

The effect of electrode material and additives on the breakdown strength of a vacuum gap

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING ELEMENTS; COBALT; COPPER ALLOYS; ELECTRIC BREAKDOWN OF SOLIDS; ELECTRODES; TUNGSTEN; VACUUM;

EID: 0032047543     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/94.671947     Document Type: Article
Times cited : (10)

References (9)
  • 1
    • 0028385597 scopus 로고
    • Advances in Material Development for High Power Vacuum Interrupter Contacts
    • Vol. 0. 17, Mar.
    • P. G. Slade, "Advances in Material Development for High Power Vacuum Interrupter Contacts", IEEE Trans. on CPMT, Vol. 0. 17, No. 1, pp. 96-106, Mar. 1994.
    • (1994) IEEE Trans. on CPMT , Issue.1 , pp. 96-106
    • Slade, P.G.1
  • 2
    • 0024752558 scopus 로고
    • Metallurgical Aspects of Contact Materials for Vacuum Switch Devices
    • Oct.
    • P. Frey, N. Klink, R. Michal and K. E. Saeger, "Metallurgical Aspects of Contact Materials for Vacuum Switch Devices", IEEE Trans. on Plasma Science, Vol. 17, No. 5, pp. 734-740, Oct. 1989.
    • (1989) IEEE Trans. on Plasma Science , vol.17 , Issue.5 , pp. 734-740
    • Frey, P.1    Klink, N.2    Michal, R.3    Saeger, K.E.4
  • 3
    • 33747742556 scopus 로고    scopus 로고
    • Contact materials for vacuum circuit breaker, U. S. Patent 4575451, Mar. 1986
    • E. Naya and M. Okumura, Contact materials for vacuum circuit breaker, U. S. Patent 4575451, Mar. 1986.
    • Naya, E.1    Okumura, M.2
  • 4
    • 33747738042 scopus 로고    scopus 로고
    • Contact of Vacuum Interrupter and Manufacturing Process Therefor, U. S. Patent 4554425, Nov. 1985
    • Y. Kashiwagi, Y. Noda, K. Kitakizaki and Higashimine, Contact of Vacuum Interrupter and Manufacturing Process Therefor, U. S. Patent 4554425, Nov. 1985.
    • Kashiwagi, Y.1    Noda, Y.2    Kitakizaki, K.3    Higashimine4
  • 5
    • 0030104264 scopus 로고    scopus 로고
    • Influence of Microstructure on Dielectric Strength of CuCr Contact Materials in a Vacuum
    • Mar.
    • B. J. Ding, Z. M. Yang and X. T. Wang, "Influence of Microstructure on Dielectric Strength of CuCr Contact Materials in a Vacuum", IEEE Trans. on CPMT, Vol. 19, No. 1, pp. 76-81, Mar. 1996.
    • (1996) IEEE Trans. on CPMT , vol.19 , Issue.1 , pp. 76-81
    • Ding, B.J.1    Yang, Z.M.2    Wang, X.T.3
  • 6
    • 33747718761 scopus 로고    scopus 로고
    • Metallography, Structure and Phase Diagrams
    • American Society for Metals
    • Metals Handbook, Metallography, Structure and Phase Diagrams, Vol. 8, American Society for Metals, pp. 292.
    • Metals Handbook , vol.8 , pp. 292
  • 8
    • 0024685648 scopus 로고
    • Influence of Composition and Cr Particle Size of Cu/Cr Contacts on Chopping Current, Contact Resistance, and Breakdown Voltage in Vacuum Interrupters
    • June
    • W. F. Rieder, M. Schussk, W. Glatzle and E. Kny, "Influence of Composition and Cr Particle Size of Cu/Cr Contacts on Chopping Current, Contact Resistance, and Breakdown Voltage in Vacuum Interrupters", IEEE Trans. on CPMT, Vol. 12, No. 2, pp273-283, June 1989.
    • (1989) IEEE Trans. on CPMT , vol.12 , Issue.2 , pp. 273-283
    • Rieder, W.F.1    Schussk, M.2    Glatzle, W.3    Kny, E.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.