Siloxane modified polyimides for microelectronics coating applications

High Performance Polymers

Volumn 10, Issue 1, 1998, Pages 69-80

  Yamada, Yasuharu ^a,b  

^a NIPPON STEEL CORPORATION   (Japan)

^b NONE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; INTEGRATED CIRCUITS; PERMITTIVITY; PLASTIC FILMS; SILICON COMPOUNDS; SILICON WAFERS; SILICONES;

POLYMER MODIFICATION; SILOXANES;

POLYIMIDES;

EID: 0032028742     PISSN: 09540083     EISSN: None     Source Type: Journal    
DOI: 10.1088/0954-0083/10/1/009     Document Type: Article

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