Fatigue properties of microelectronics solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 113, Issue 2, 1991, Pages 92-101

  Nir, N ^a   Dudderar, T D ^a   Wong, C C ^a   Storm, A ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTROL SYSTEMS - COMPUTER AIDED ENGINEERING; MICROELECTRONICS - SOLDERING;

INTERCONNECTION STRUCTURES; MICROELECTRONIC SOLDER JOINTS;

SOLDERING;

EID: 0026168850     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905390     Document Type: Article

References (16)

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