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Volumn 17, Issue 5, 1998, Pages 367-369
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Thermal chemical vapour deposition of copper films from copper ethylacetoacetate: Microstructure and electrical resistivity
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Author keywords
[No Author keywords available]
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Indexed keywords
AUGER ELECTRON SPECTROSCOPY;
CHELATION;
CHEMICAL VAPOR DEPOSITION;
COPPER;
ELECTRIC CONDUCTIVITY OF SOLIDS;
FILM GROWTH;
MICROSTRUCTURE;
SCANNING ELECTRON MICROSCOPY;
SILICA;
SUBLIMATION;
THERMAL EFFECTS;
X RAY DIFFRACTION ANALYSIS;
COPPER ETHYLACETOACETATE;
LIGANDS;
METALLIC FILMS;
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EID: 0032027390
PISSN: 02618028
EISSN: None
Source Type: Journal
DOI: 10.1023/A:1006518714011 Document Type: Article |
Times cited : (10)
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References (10)
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