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Volumn 17, Issue 5, 1998, Pages 367-369

Thermal chemical vapour deposition of copper films from copper ethylacetoacetate: Microstructure and electrical resistivity

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CHELATION; CHEMICAL VAPOR DEPOSITION; COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; FILM GROWTH; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILICA; SUBLIMATION; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

EID: 0032027390     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1006518714011     Document Type: Article
Times cited : (10)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.