Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip

Circuit World

Volumn 23, Issue 4, 1997, Pages 22-25

  Lau, J H ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

Electronics packaging; Integrated circuit; Microelectronics

Indexed keywords

ECONOMIC AND SOCIAL EFFECTS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MICROPROCESSOR CHIPS;

BALL GRID ARRAY (BGA); CHIP SCALE PACKAGING (CSP); DIRECT CHIP ATTACH (DCA);

ELECTRONICS PACKAGING;

EID: 0031167048     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129710370277     Document Type: Article

References (27)

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