A percolative simulation of dielectric-like breakdown

Microelectronics Reliability

Volumn 38, Issue 2, 1998, Pages 249-253

  Pennetta, C ^a   Gingl, Z ^b   Kiss, L B ^c   Reggiani, L ^d   De Vittorio, M ^d   Cola, A ^e   Mazzer, M ^e  

^a UNIVERSITY OF SALENTO   (Italy)

^b UNIVERSITY OF SZEGED   (Hungary)

^c UPPSALA UNIVERSITY   (Sweden)

^d INFM   (Italy)

^e Istituto per lo Studio di Nuovi   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC BREAKDOWN OF SOLIDS; THIN FILM DEVICES;

BIASED PERCOLATION MODELS;

DIELECTRIC FILMS;

EID: 0031994417     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00046-2     Document Type: Article

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