Frequency characteristics of ultrasonic wire bonding using high frequency vibration systems of 40 kHz to 780 kHz

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 1996, Pages 1021-1026

  Tsujino, Jiromaru ^a   Hasegawa, Koichi ^a   Sone, Yukio ^a   Nozaki, Koji ^a  

^a KANAGAWA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; FREQUENCIES; LSI CIRCUITS; TEMPERATURE MEASUREMENT; ULTRASONIC VELOCITY MEASUREMENT; VIBRATIONS (MECHANICAL); WIRE;

THERMO-ELECTRIC-MOTIVE FORCE; ULTRASONIC WIRE BONDING;

ULTRASONIC WELDING;

EID: 0030374638     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)