A three-dimensional numerical method for thermal analysis in X-ray lithography

International Journal of Numerical Methods for Heat and Fluid Flow

Volumn 8, Issue 4, 1998, Pages 409-423

  Dai, W ^a   Nassar, R ^a  

^a Louisiana Tech University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DIFFERENTIAL EQUATIONS; ELECTROPLATING; IRRADIATION; MATHEMATICAL MODELS; MICROSTRUCTURE; PHOTORESISTORS; SILICON; THERMAL EXPANSION; THERMOANALYSIS; ALGORITHMS; NUMERICAL METHODS; PARTIAL DIFFERENTIAL EQUATIONS; PHOTORESISTS; POLYMETHYL METHACRYLATES; SEMICONDUCTING SILICON; SUBSTRATES; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS;

PARABOLIC DIFFERENTIAL EQUATIONS; SILICON SUBSTRATES; X-RAY IRRADIATED PHOTORESISTS; POISSON EQUATION; RICHARDSON METHOD; STEADY STATE TEMPERATURE PROFILE;

X RAY LITHOGRAPHY;

LITHOGRAPHY; RICHARDSON NUMBER; X-RAY;

EID: 0031706913     PISSN: 09615539     EISSN: None     Source Type: Journal    
DOI: 10.1108/09615539810213188     Document Type: Article

References (13)

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