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Volumn 37, Issue 1, 1998, Pages 5-9
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Mechanism of residue formation in silicon trench etching using a bromine-based plasma
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Author keywords
Etching; HBr; Oxygen precipitation; Plasma; Reactive ion etching; Residue; Silicon; Silicon needle; Trench
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Indexed keywords
NUCLEATION;
OPTICAL MICROSCOPY;
OXIDATION;
OXYGEN;
PLASMA ETCHING;
PRECIPITATION (CHEMICAL);
REACTION KINETICS;
REACTIVE ION ETCHING;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTOR DEVICE MODELS;
SILICA;
SILICON TRENCH ETCHING;
SILICON WAFERS;
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EID: 0031695002
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/JJAP.37.5 Document Type: Article |
Times cited : (16)
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References (19)
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