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Volumn 37, Issue 1, 1998, Pages 5-9

Mechanism of residue formation in silicon trench etching using a bromine-based plasma

Author keywords

Etching; HBr; Oxygen precipitation; Plasma; Reactive ion etching; Residue; Silicon; Silicon needle; Trench

Indexed keywords

NUCLEATION; OPTICAL MICROSCOPY; OXIDATION; OXYGEN; PLASMA ETCHING; PRECIPITATION (CHEMICAL); REACTION KINETICS; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MODELS; SILICA;

EID: 0031695002     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.37.5     Document Type: Article
Times cited : (16)

References (19)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.