Dynamic Recrystallization under Warm Deformation of Polycrystalline Copper

ISIJ International

Volumn 38, Issue 6, 1998, Pages 595-601

  Belyakov, Andrey ^a   Miura, Hiromi ^a   Sakai, Taku ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

Dislocation substructure; Dynamic recovery; Dynamic recrystallization; Mechanism of new grain formation; Pure copper; Warm deformation

Indexed keywords

COMPRESSION TESTING; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; PLASTIC FLOW; POLYCRYSTALLINE MATERIALS; RECRYSTALLIZATION (METALLURGY); STRAIN RATE; TWINNING;

DYNAMIC RECOVERY; WARM DEFORMATION;

COPPER;

EID: 0031685848     PISSN: 09151559     EISSN: None     Source Type: Journal    
DOI: 10.2355/isijinternational.38.595     Document Type: Article

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