Applications of passive integration

Philips Journal of Research

Volumn 51, Issue 3, 1998, Pages 411-428

  Pulsford, N J ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; INTEGRATED CIRCUITS; SURFACE MOUNT TECHNOLOGY;

ELECTROMAGNETIC SIMULATION; ELECTRONIC DATA PROCESSING; PASSIVE INTEGRATION TECHNOLOGY;

PASSIVE NETWORKS;

EID: 0031639361     PISSN: 01655817     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0165-5817(98)00015-1     Document Type: Article

References (9)

1. Robert C. Frye, Passive Components in Electronic Applications: Requirements and Prospects for Integration, J.Microcircuits and Electronic Packaging vol. 19, no. 4 , 483 (1996).
2. Philips Components PA06 Data Handbook, Ceramic Capacitors, Philips Electronics N.V. (1995).
3. see for example, Bernard Levine, Chip Scale Packaging Blooms. Electronic News, 1 (Sept 16, 1996).
4. see for example, Daryl A. Doane and Paul D. Franzon, The Case for Multichip Modules, Semiconductor International, p. 85 (April 1994).
5. Philips Semiconductor Data Sheet PCF79730S Programmable Identification Transponder (Jan 1996).
6. to be published; see also A.C. Reyes et al., High Resistivity Si as a Microwave Substrate, 1996 Electronic Components and Technology Conf., p. 382.
7. the author acknowledges discussions with Bob Milsom, Marc van Delden and Arjan Leeuwenburgh.
8. see for example, RF/IF Designer s Handbook, Mini-Circuits Inc., (Brooklyn, NY 1997).
9. see for example, P. Horwitz and W. Hill, The Art of Electronics, p. 428 (CUP 1980).