Adhesion integrity evaluation of plastic encapsulated semiconductor package

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1132-1139

  Kawamura, N ^a   Hirohata, K ^a   Kawakami, T ^a   Sawada, K ^a   Mino, T ^a   Kurosu, A ^a   Takano, E ^a   Yeoul, Yoo Hee ^b  

^a TOSHIBA CORPORATION   (Japan)

^b Anam Industrial Co   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); NETWORK COMPONENTS; RESINS; SHEARING; SOLDERING; STRESS ANALYSIS; STRESS CONCENTRATION; EPOXY RESINS; PLASTICS APPLICATIONS; SEMICONDUCTING SILICON;

ADHESION INTEGRITY; PLASTIC PACKAGES; QUAD FLAT PACKAGE; REFLOW--SOLDERING; RELIABILITY TEST; SEMICONDUCTOR PACKAGES; SHEARING LOADS; THREE DIMENSIONAL STRESS ANALYSIS;

EPOXY RESINS; ELECTRONICS PACKAGING;

ADHESION STRENGTH; PLASTIC ENCAPSULATED SEMICONDUCTOR PACKAGES; QUAD FLAT PACKAGES (QFP);

EID: 0031633692     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678858     Document Type: Conference Paper

References (7)

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7. Inoue, Y. Sawada, K., Kawamura, N., Sudo, T., "A Synthetic Criterion for Level-1 Crack-free Package", Proc 46th ECTC, 1996, pp. 71.