Anodization for forming thin film embedded capacitors in MCM-D and MCM-L substrates

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 247-251

  Nelms, D ^a   Ulrich, R ^a   Schaper, L ^a   Reeder, S ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM OXIDE; ANODIC OXIDATION; CAPACITANCE; CHIP SCALE PACKAGES; DEFECTS; ELECTRIC RESISTANCE; ETHYLENE; ETHYLENE GLYCOL; NETWORK COMPONENTS; SILICON WAFERS; TANTALUM OXIDES; THIN FILMS; AGING OF MATERIALS; ANNEALING; CAPACITORS; DIELECTRIC PROPERTIES OF SOLIDS; POLYIMIDES; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES; THIN FILM DEVICES;

ANODIZATION PROCESS; ANODIZATION VOLTAGES; DECOUPLING CAPACITOR; DIELECTRIC THICKNESS; EFFECTIVE SERIES RESISTANCES; EMBEDDED CAPACITOR; LOW DEFECT DENSITIES; MULTI CHIP PACKAGING;

SUBSTRATES; MULTICHIP MODULES;

LAMINATED MULTICHIP MODULES (MCML); THIN FILM EMBEDDED CAPACITORS;

EID: 0031628868     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678701     Document Type: Conference Paper

References (7)

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