Thermally stable thin film tantalum pentoxide capacitor for MCM applications

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 4, 1996, Pages 364-368

  Peters, Michael ^a,b,c,d,e   Lee, Michael G ^a,d,f,g   Takahashi, Yasuhito ^a,d,h,i   Beilin, Solomon ^a,c,d,j,k  

^a FUJITSU LABORATORIES OF AMERICA   (United States)

^b STANFORD UNIVERSITY   (United States)

^c Crystallume ^*

^d Substrate Technology Department

^e Technical Staff

^f UNIVERSITY OF CINCINNATI   (United States)

^g UNIVERSITY OF ROCHESTER   (United States)

^h NIIGATA UNIVERSITY   (Japan)

ⁱ FUJITSU LABORATORIES LTD   (Japan)

^j MOSCOW INSTITUTE OF PHYSICS AND TECHNOLOGY   (Russian Federation)

^k RUSSIAN ACADEMY OF SCIENCES   (Russian Federation)

more..

Author keywords

Integral Capacitor; Multichip Module (MCM); Tantalum Pentoxide; Thin Film Capacitor

Indexed keywords

CAPACITORS; FABRICATION; MULTICHIP MODULES; TANTALUM; THERMODYNAMIC STABILITY;

INTEGRAL CAPACITOR; TANTALUM PENTOXIDE; THIN FILM CAPACITOR;

THIN FILMS;

EID: 0030407558     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

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