Computational simulation of underfill encapsulation of flip-chip ICs. I. Flow modeling and surface-tension effects

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1311-1317

  Yang, H ^a   Bayyuk, S ^a   Krishnan, A ^a   Przekwas, A ^a   Nguyen, L ^b   Fine, P ^b  

^a CFD RESEARCH CORPORATION   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATION THEORY; COMPUTATIONAL METHODS; DROPS; FLIP CHIP DEVICES; FORECASTING; INTERFACE STATES; NETWORK COMPONENTS; PHASE INTERFACES; RESINS; STRAIN RATE; SURFACE TENSION; TIMING CIRCUITS; VISCOSITY; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ENCAPSULATION; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); TWO PHASE FLOW;

COMPUTATIONAL SIMULATION; COMPUTATIONAL TECHNIQUE; SIMULATION METHODOLOGY; STATE-OF-THE-ART TECHNIQUES; STRAIN RATE DEPENDENCE; SURFACE TENSION EFFECTS; SURFACE TENSION MODELING; UNDERFILL ENCAPSULATION;

NON NEWTONIAN FLOW; ELECTRONICS PACKAGING;

VOLUME OF FLUID (VOF) METHODOLOGY;

EID: 0031625139     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678912     Document Type: Conference Paper

References (9)

1. L. Nguyen, A. Chen, S. Bayyuk, A. Krishnan, A. Przekwas, S.-A. Bidstrup-Allen, "A CAD-Based Flow Modeling Tool for Plastic IC Encapsulation, " INTERpack'97 Conference, Hawaii, June 1997.
2. H. Yang, S. Bayyuk, A. Krishnan, A. Przekwas, L. Nguyen, P. Fine, "Computational Simulation of Underfill Encapsulation of Flip-Chip ICs, Part II: Filler-Particle Modeling and Hele-Shaw Reduced Models, " in preparation.
3. Patankar, S., Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corporation, McGraw-Hill, 1980.
4. Hirt, C., Nichols, B., "Volume of Fluid (VOF) Method for the Dynamics of Free Boundaries, " Journal of Computational Physics, Volume 39, pp. 201-225, 1981.
5. Rider, W., Kothe, D., Mosso, S., Cerutti, J., Hochstein, J., "Accurate Solution Algorithms for Incompressible Multiphase Flows, " AIAA Paper 95-0699, 1995.
6. Kothe, D., Mjolsness, A., "RIPPLE: A New Model for Incompressible Flows with Free Surfaces, " AIAA Journal, Volume 30, pp. 2694-2700, 1992.
7. Kothe, D., Rider, W., Mosso, S., Brock, J., "Volume Tracking of Interfaces Having Surface Tension in Two-and Three-Dimensions, " AIAA Paper 96-0859, 1996.
8. Han, S., Wang, K., Cho, S.-Y, "Experimental and Analytical Study on the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips, " Proceedings of the 1996 Electronic Components and Technology Conference, pp. 327-334, 1996.
9. Cotts, E., Lehmann, G., Singler, T., "Underflow Process Development: Annual Report, " Binghamton University, August 1997.