Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites

Surface Engineering

Volumn 14, Issue 3, 1998, Pages 259-264

  Legois, Y ^a   Aucouturier, M ^a   Ollivier, E ^b   Darque Ceretti, E ^c   Macheto, P ^d  

^a UNIVERSITÉ PARIS SACLAY   (France)

^b Aerospatiale   (France)

^c PSL RESEARCH UNIVERSITY   (France)

^d ONERA   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); CHEMICAL BONDS; COPPER; GLASS FIBER REINFORCED PLASTICS; INTERFACES (MATERIALS); MAGNETRON SPUTTERING; POLYAMIDES; PRESSURE EFFECTS; SURFACE STRUCTURE; TENSILE TESTING; THERMAL EFFECTS;

DEPTH PROFILING;

METALLIC FILMS;

EID: 0031625009     PISSN: 02670844     EISSN: None     Source Type: Journal    
DOI: 10.1179/sur.1998.14.3.259     Document Type: Article

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