Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices

Microelectronic Engineering

Volumn 33, Issue 1-4, 1997, Pages 217-221

  Popovici, D ^a   Klemberg Sapieha, J E ^a   Czeremuszkin, G ^a   Sacher, E ^a   Meunier, M ^a   Martinu, L ^a  

^a ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CARBIDES; CHEMICAL BONDS; COPPER; CROSSLINKING; EVAPORATION; FLUORINE; METALLIZING; OXYGEN; SPUTTER DEPOSITION; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER METALLIZATION; DEFLUORINATION; GRAPHITIZATION;

MICROELECTRONIC PROCESSING;

EID: 0000799604     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0167-9317(96)00048-2     Document Type: Article

References (10)

1. P. Singer, Semiconductor International November (1994) 52.
2. E. Sacher, Prog. Surf. Sci. 47 (1994) 273.
3. DuPont Specialty Polymers, Technical Information Bulletins H-16577-1 and H-52454.
4. J.R. Waldrop and R.W. Grand, J. Vac. Sci. Technol. A1 (1983) 1553.
5. J.R. Waldrop, P. Kowalczyk and R.W. Grand, J. Vac. Sci. Technol. 21 (1982) 607.
6. D. Popovici, J.E. Klemberg-Sapieha, G. Czeremuszkin, A. Alptekin, L. Martinu, M. Meunier and E. Sacher, in: K. Mittal, ed., Metallized Plastics, submitted.
7. C.D. Wagner, W, M. Riggs, L.E. Davis, J.F. Moulder and G.E. Mulinberg, Handbook of X-ray Photoelectron Spectroscopy Perkin-Elmer Corporation, Eden Prarie, MN, 1979.
8. E. Sacher and J.E. Klemberg-Sapieha, J. Vac. Sci. Technol., submitted.
9. R.E. Honig, RCA Rev. 18 (1957) 195.
10. The Handbook of Thin Film Technology, C.I. Maissel, R. Glang, eds., McGraw-Hill, N.Y., 1970.