Evaluation of solder joint reliability between PWB and CSP by using high TCE ceramic material

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1260-1264

  Yonekura, H ^a   Higashi, M ^a   Hmada, N ^a   Yamaguchi, K ^a   Kokubu, M ^a   Ikemizu, M ^b   Nakano, J ^b   Yokoi, T ^b   Funakura, H ^b  

^a KYOCERA CORPORATION   (Japan)

^b TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM OXIDE; BALL GRID ARRAYS; ELASTIC MODULI; ELECTRONICS PACKAGING; NETWORK COMPONENTS; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; CERAMIC MATERIALS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; STRESS ANALYSIS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION;

ALUMINA CERAMIC BALL; CHIP ASSEMBLY; HIGH RELIABILITY; SOLDER JOINT RELIABILITY; SOLDER JOINTS; STRESS SIMULATIONS; THERMAL COEFFICIENT OF EXPANSION; THERMAL CYCLING TEST;

CERAMIC MATERIALS; ELECTRONICS PACKAGING;

BALL GRID ARRAYS (BGA); CHIP SCALE PACKAGES (CSP); THERMAL COEFFICIENT OF EXPANSION (TCE);

EID: 0031620450     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678899     Document Type: Conference Paper

References (4)

1. Robert Marrs, 'Trends In IC Packaging", Electronic Packaging & Production, vol. 36, No. 9, 1996, pp. 24-30.
2. Koichi Yamaguchi, Masahiko Higashi, Michio Shinozaki, Noriaki Hamada, Hideto Yonekura and Masanari Kokubu, "Improvement of Solder Joint Reliability between Chip Scale Package and Printed Wiring Board by New Ceramic Material", SEMICONTest, Assembly &Packaging 97 Singapore, Proceedings, pp. 225-232.
3. Morihiko Ikemizu, Yuji Fukuzawa, Jirou Nakano, Tetsuya Yokoi, Kenji Miyajima, Hiroshi Funakura and Eiichi Hosomi, "CSP Solder Ball Rdmbi\Uy", 1997 IEEE/CPMT International Electronics Manufacturing Technology Symposium, Proceedings, pp. 447-451.
4. Yutaka Tsukada, "Consideration for BGA joint reliability", Japan Institute for Interconnecting and Packaging Electronic Circuits, 2nd symposium on evaluation technology, Proceedings, pp. 1-7.