CSP solder ball reliability

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 447-451

  Ikemizu, Morihiko ^a   Fukuzawa, Yuji ^a   Nakano, Jirou ^a   Yokoi, Testuya ^a   Miyajima, Kenji ^a   Funakura, Hiroshi ^a   Hosomi, Eiichi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERAMIC MATERIALS; FINITE ELEMENT METHOD; PLASTICS APPLICATIONS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SOLDERED JOINTS; SOLDERING; THERMAL EXPANSION;

CERAMIC FINE PITCHED BALL GRID ARRAYS (CFBGA); CHIP SCALE PACKAGES (CSP); COEFFICIENT THERMAL EXPANSION (CTE); PLASTIC FINE PITCHED BALL GRID ARRAYS (PFBGA);

ELECTRONICS PACKAGING;

EID: 0031336968     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)