X-ray mask fabrication using new membrane process techniques

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 12 SUPPL. B, 1997, Pages 7580-7585

  Uchiyama, Shingo ^a   Oda, Masatoshi ^a   Matsuda, Tadahito ^a   Shigehisa Ohki, ^b  

^a NTT CORPORATION   (Japan)

^b NTT Advanced Technology Corporation   (Japan)

Author keywords

Electron beam writing; Heat sink; Holding deformation; Membrane process; Pattern placement accuracy; X ray lithography; X ray mask

Indexed keywords

DRY ETCHING; ELECTRON BEAM LITHOGRAPHY; HEAT SINKS; INTEGRATED CIRCUIT MANUFACTURE; MASKS; PHOTORESISTS; SILICON WAFERS;

BACKETCHING; ELECTRON BEAM WRITING; MEMBRANE PROCESS TECHNIQUES; PATTERN PLACEMENT ACCURACY; X RAY MASKS;

X RAY LITHOGRAPHY;

EID: 0031345940     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.7580     Document Type: Article

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