Representation of Thermal Behavior of Electronic Components for the Creation of a Databank

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 14, Issue 2, 1991, Pages 366-373

  Pierre, Jean ^a   Jannou, Le ^a   Huon, Yves ^a  

^a ORANGE LABS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING - THERMAL PROPERTIES; TEMPERATURE MEASUREMENT - COMPUTER SIMULATION;

CHIP TEMPERATURES; DATABANK CREATION; ELECTRONIC COMPONENTS; THERMAL BEHAVIOR;

INTEGRATED CIRCUITS;

EID: 0026171572     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.87317     Document Type: Article

References (15)

1. R. J. Hannemann. “Microelectronic device thermal resistance: A format for standardization,” in Proc. Winter Ann. Meeting of ASME, Washington, DC, Nov. 1981.
2. K. E. Manchester and D. W. Bird, “Thermal resistance: A reliability consideration,” IEEE Trans. Comp. Hybrids, Manuf. Technol., vol. CHMT-3, Dec. 1980.
3. A. Bar-Cohen, T. Elperin, and R. Eliasi, “ΘJC characterization of chip packages: Justification, limitations and future,” in Proc. 5th IEEE Semi-Therm Sympo., San Diego, 1989.
4. J. A. Andrews, “Package thermal resistance model: Dependency on equipment design,” IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 11, Dec. 1988.
5. MM. Alii, M. Mahalingam, and J. A. Andrews, “Thermal characteristics of plastic small outline transistor (SOT) packages,” in Proc. 36th Electronic Components Conf., Seattle, May 1986.
6. J. A. Andrews, L. M. Mahalingam, and H. M. Berg, “Thermal characteristics of 16- and 40-Pin Plastic DIP’s,” IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. CHMT-4, Dec. 1981.
7. J. B. Saulnier, P. Merour, and J. P. Le Jannou, “Développement, validation et réduction d’un modèle thermique de composants électroniques,” in Proc. 2ème colloque national sur la Thermique, I’Energie et I’Environnement des matériels de Télécommunications, Perros-Guirec, France, June 1985.
8. H. Charlier and M. Bonnifait, “Analyse thermique tridimensionnelle par éléments finis-Applications aux composants électroniques,” Revue générale de thermique, no. 280, April 1985.
9. M. Bonnifait, M. Cadre, and H. Charlier, “Thermal simulation for electronic components using finite-elements and nodal networks,” in Proc. 4th AIAA /ASME Thermophysics and Heat Transfer Conf., Boston, MA, June 1986.
10. S. S. Furkay, “Thermal characterization of plastic and ceramic surface—Mount components,” IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 11, Dec. 1988.
11. F. Kreith, Principles of Heat Transfer. Paris, France: Masson, 1967, ch. 7, pp. 345–346.
12. A. D. Kraus and A. Bar Cohen, Thermal Analysis and Control of Electronic Equipment. New York: Hemisphere 1983, ch. 6, pp. 133–134.
13. Y. Huon, J. P. Le Jannou, and P. Paris, “Constitution d’une banque de données thermiques (CITHERE) des circuits intégrés,” in Proc. 3e Colloque sur la Thermique, l’Energie et l’Environnement des Materiels de Télécommunications, Perros-Guirec, France, June 1989.
14. M. Mahalingam et al., “Thermal effects of die bond voids in metal, ceramic, and plastic packages,” in Proc. IEEE 34th Electronics Components Conf., 1984.
15. Y. Huon and J. P. Le Jannou, “Logiciel COMPOSIT de détermination et de résolution des réseaux résistifs représentatifs du comportement thermique des circuits intégrés,” in Proc. 3e Colloque sur le Thermique, l’Energie et l’Environnement des Matériels de Télécommunications, Perros-Guirec, France, June 1989.