Effects of Au coating on thermal stresses in stainless-to-Kovar packages

Optical and Quantum Electronics

Volumn 29, Issue 10, 1997, Pages 939-951

  Cheng, W H ^a   Wang, W H ^a   Yang, Y D ^a   Kuang, J H ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; GOLD; HEAT CONDUCTION; LASER BEAM WELDING; STAINLESS STEEL; THERMAL STRESS;

GOLD COATINGS; HEADERS; THICKNESS EFFECT;

SEMICONDUCTOR LASERS;

EID: 0031249542     PISSN: 03068919     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018537918940     Document Type: Article

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