FD-TD Modeling of Digital Signal Propagation in 3-D Circuits With Passive and Active Loads

IEEE Transactions on Microwave Theory and Techniques

Volumn 42, Issue 8, 1994, Pages 1514-1523

  Piket May, Melinda ^a   Taflove, Allen ^b   Baron, John ^c  

^a UNIVERSITY OF COLORADO   (United States)

^b NORTHWESTERN UNIVERSITY   (United States)

^c STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL CIRCUITS; ELECTRIC NETWORK PARAMETERS; ELECTROMAGNETIC WAVE PROPAGATION; FINITE DIFFERENCE METHOD; LINEAR INTEGRATED CIRCUITS; MATHEMATICAL MODELS; NONLINEAR NETWORKS; NUMERICAL METHODS; TIME DOMAIN ANALYSIS;

ACTIVE LOADS; COMPUTER AIDED CIRCUIT DESIGN TOOLS; DIGITAL SIGNAL PROPAGATION; FINITE DIFFERENCE TIME DOMAIN METHOD; PASSIVE LOADS; THREE DIMENSIONAL CIRCUITS;

COMPUTER AIDED LOGIC DESIGN;

EID: 0028485847     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.297814     Document Type: Article

References (16)

1. A. Taflove, “Review of the formulation and applications of the finite-difference difference time-domain method for numerical modeling of electromagnetic wave interactions with arbitrary structures,” Wave Motion, vol. 10, pp. 547–582, Dec. 1988.
2. K. S. Yee, “Numerical solution of initial boundary value problems involving Maxwell's equations in isotropic media,” IEEE Trans. Antennas Propagat., vol. 14, pp. 302–307, May 1966.
3. G.-C. Liang, Y.-W. Liu, and K. K. Mei, “Full-wave analysis of coplanar waveguide and slotline using the time-domain finite-difference method,” IEEE Trans. Microwave Theory Tech., vol. 37, pp. 1949–1957, Dec. 1989.
4. T. Shibata and E. Sano, “Characterization of MIS structure coplanar transmission lines for investigation of signal propagation in integrated circuits,” IEEE Trans. Microwave Theory Tech., vol. 38, pp. 881–890, July 1990.
5. C. W. Lam, S. M. Ali, R. T. Shin, and J. A. Kong, “Radiation from discontinuities in VLSI packaging structures,” Proc. Progress in Electromagnetics Research Symp., Boston, MA, July 1991, p. 567.
6. S. Maeda, T. Kashiwa, and I. Fukai, “Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method,” IEEE Trans. Microwave Theory Tech., vol. 39, pp. 2154–2159, Dec. 1991.
7. E. Sano and T. Shibata, “Fullwave analysis of picosecond photoconductive switches,” IEEE J. Quantum Electron., vol. 26, pp. 372–377. Feb. 1990.
8. S. M. El-Ghazaly, R. P. Joshi and R. O. Grondin, “Electromagnetic and transport considerations in subpicosecond photoconductive switch modeling,” IEEE Trans. Microwave Theory Tech., vol. 38, pp. 629–637, May 1990.
9. W. Sui, D. A. Christensen and C. H. Durney, “Extending the two-dimensional dimensional FD-TD method to hybrid electromagnetic systems with active and passive lumped elements,” IEEE Trans. Microwave Theory Tech., vol. 40, pp. 724–730, Apr. 1992.
10. A. Tat-love, “Basis and Application of Finite-Difference Time-Domain (FD-TD) Techniques for Modeling Electromagnetic Wave Interactions,” (short course notes), 1992 IEEE Antennas and Propagation Soc. Int. Symp. and URSI Radio Sci. Meeting, Chicago, IL, July 1992.
11. A. Taflove and M. E. Brodwin, “Numerical solution of steady-state electromagnetic scattering problems using the time-dependent Maxwell's equations,” IEEE Trans. Microwave Theory Tech., vol. 23, pp. 623–630, Aug. 1975.
12. G. Mur, “Absorbing boundary conditions for the finite-difference approximation of the time-domain electromagnetic field equations.” IEEE Trans. Electrornagn. Compat., vol. 23, pp. 377–382, Nov. 1981.
13. S. Ramo, J. R. Whinnery and T. Van Duzer. Fields and Waves in Communications Electronics, 2nd ed. New York: Wiley, 1984, p. 410.
14. S. M. Sze, Physics of Semiconductor Devices. New York: Wiley, 1981, p. 152.
15. V. A. Thomas, M. E. Jones, M. J. Piket-May, A. Taflove and E. Harrigan, “The use of SPICE lumped circuits as sub-grid models for FD-TD analysis,” IEEE Microwave Guided Wave Lett., vol. 4, pp. 141–143, May 1994.
16. Y.-S. Tsuei, A. C. Cangellaris, and J. L. Prince, “Rigorous electromagnetic modeling of chip-to-package (first-level) interconnections,” IEEE Trans. Components, Hybrids, and Manufacturing Tech., vol. 16, pp. 876–883, Dec. 1993.