Influence of thermal heating effect on pulsed DC electromigration

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1553-1556

  Waltz, P ^a   Arnaud, L ^a   Tartavel, G ^a   Lormand, G ^b  

^a CEA LETI   (France)

^b UNIVERSITÉ DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CURRENT DENSITY; ELECTRIC CURRENTS; HEATING; INTEGRATING CIRCUITS; MATHEMATICAL MODELS; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS;

AVERAGE CURRENT MODEL; THERMAL HEATING;

ELECTROMIGRATION;

EID: 0031246683     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00107-8     Document Type: Article

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