Thermal modeling of densely packed electronic systems

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1996, Pages 97-104

  Maudgal, V ^a  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CORRELATION THEORY; HEAT TRANSFER; NATURAL CONVECTION; PHYSICAL PROPERTIES; TEMPERATURE; THERMAL CONDUCTIVITY; THREE DIMENSIONAL;

DENSELY PACKED ELECTRONIC SYSTEMS; THERMAL CONDUCTIVITY SYSTEM; THERMAL MODELING; THERMOPHYSICAL PROPERTIES;

ELECTROMECHANICAL DEVICES;

EID: 0029713212     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)