Improved method for inspection of solder joints using X-ray laminography and X-ray microtomography

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1996, Pages 438-445

  Kalukin, Andrew R ^a   Sankaran, Vijay ^a   Chartrand, Brent ^a   Millard, Don L ^a   Kraft, Russel P ^a   Embrechts, Mark J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKPROPAGATION; IMAGING TECHNIQUES; INSPECTION; NEURAL NETWORKS; SIGNAL TO NOISE RATIO; SOLDERED JOINTS; X RAY ANALYSIS;

IMAGE CLASSIFICATION; X RAY LAMINOGRAPHY; X RAY MICROTOMOGRAPHY;

PRINTED CIRCUIT BOARDS;

EID: 0030396576     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)