CAD: The numerical and analytical methods combined for the analysis of IC's thermal fields

European Design Automation Conference - Proceedings

Volumn , Issue , 1993, Pages 290-293

  Koval, V A ^a   Farmaga, I V ^a   Fedasyuk, D V ^a   Ostapchuk, A I ^a  

^a LVIV POLYTECHNIC NATIONAL UNIVERSITY   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; FINITE ELEMENT METHOD; HEAT TRANSFER; INTEGRATION; THERMAL EFFECTS;

IC THERMAL FIELD SIMULATION; INTEGRATED CIRCUIT THERMAL FIELDS; TRANSIENT THERMAL CONDUCTANCE;

INTEGRATED CIRCUITS;

EID: 0027848279     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)