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Volumn 41, Issue 7, 1997, Pages 1051-1055
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Electrical and reliability properties of thin silicon oxinitride dielectrics formed by low pressure rapid thermal chemical vapor deposition
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL VAPOR DEPOSITION;
ELECTRIC BREAKDOWN OF SOLIDS;
ELECTRIC PROPERTIES;
ELECTRON TRANSPORT PROPERTIES;
MOSFET DEVICES;
NITRIDING;
SILICON NITRIDE;
ULTRATHIN FILMS;
FOWLER NORDHEIM STRESSES;
LOW PRESSURE RAPID THERMAL CHEMICAL VAPOR DEPOSITION;
DIELECTRIC FILMS;
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EID: 0031191770
PISSN: 00381101
EISSN: None
Source Type: Journal
DOI: 10.1016/S0038-1101(97)00019-1 Document Type: Article |
Times cited : (1)
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References (13)
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