Chemical vapor deposition of copper thin films using new organometallic precursors with alkoxysilylolefin ligands

Journal of the Electrochemical Society

Volumn 144, Issue 6, 1997, Pages

  Senzaki, Yoshihide ^a   Kobayashi, Masato ^a   Charneski, Lawrence J ^a   Nguyen, Tue ^a  

^a Sharp Microelectronics Technology Inc Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; ORGANOMETALLICS; SILANES; THERMODYNAMIC STABILITY; THIN FILMS; WATER;

ALKOXYSILYLOLEFIN LIGANDS;

METALLIC FILMS;

EID: 0031168771     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837708     Document Type: Article

References (6)

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