Evaluating 300-mm fab automation technology options and selection criteria

MICRO

Volumn 15, Issue 6, 1997, Pages

  Weiss, Mitchell ^a,b  

^a PRI Automation ^*  (United States)

^b PRI Automation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; CONTROL SYSTEMS; COST EFFECTIVENESS; FACTORY AUTOMATION; LOADING; MATERIALS HANDLING EQUIPMENT; PERFORMANCE; PRODUCTIVITY; ROBOTS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; STANDARDS;

AUTOMATED GUIDED VEHICLES; KINEMATIC COUPLING LOADING; MANUFACTURING LEAD TIME; WAFER CARRIERS;

MATERIALS HANDLING;

EID: 0031168125     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (6)

1. Groover M, Automation, Production Systems and Computer Integrated Manufacturing, New York, Prentice-Hall, 1987.
2. "IC Factory Design for 300-mm Wafer Line Standardizing Study," second lecture at the Japan 300-mm Semiconductor Technology Conference (J300), Waseda University, Tokyo, December 1996.
3. 3, rev. D, 1996.
4. VanLeeuwen C, "Implications of 300-mm for Fab Design and Automation," Semiconductor International, 19(4):91, 1996.
5. Weiss M, "Overall Factory Effectiveness (OFE) and Its Implications for 300-mm Tool Automation," Semiconductor Fabtech, fifth ed, pp 57-62, 1997.
6. Weiss M, "Using Analytical Methods to Accelerate Material Handling System Design Optimization," presented at the SEMI Taiwan Technical Symposium, National Technical University, Hsinchu, Taiwan, September 1995.