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Journal of Electroanalytical Chemistry

Volumn 430, Issue 1-2, 1997, Pages 69-76

Cu + Au alloy particles formed in the underpotential deposition region of copper in acid solutions

(2) Lu, Da Ling a Tanaka, Ken Ichi a

a UNIVERSITY OF TOKYO (Japan)

Author keywords

Alloy particle; Anion; Cu + au alloy; Layer by layer growth; Transmission electron microscopy; Underpotential deposition

Indexed keywords

COPPER ALLOYS; ELECTROCHEMICAL ELECTRODES; GOLD ALLOYS; IONS; SULFURIC ACID; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROCHEMICAL CODEPOSITION; UNDERPOTENTIAL DEPOSITION;

ELECTRODEPOSITION;

EID: 0031152465 PISSN: 15726657 EISSN: None Source Type: Journal
DOI: 10.1016/S0022-0728(97)00074-0 Document Type: Article

Times cited : (13)

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