An extended hexagon model for Cu underpotential deposition on Au( 111)

Journal of Electroanalytical Chemistry

Volumn 409, Issue 1-2, 1996, Pages 79-86

  Legault, M ^a   Blum, L ^a   Huckaby, Dale A ^b  

^a UNIVERSITY OF PUERTO RICO RIO PIEDRAS   (Puerto Rico)

^b TEXAS CHRISTIAN UNIVERSITY   (United States)

Author keywords

Adsorption isotherm; Copper underpotential; Mean field; Voltammogram

Indexed keywords

ADSORPTION ISOTHERMS; COPPER; CYCLIC VOLTAMMETRY; ELECTRODEPOSITION; GOLD; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; STATISTICAL MECHANICS;

COPPER UNDERPOTENTIAL DEPOSITION; HARD HEXAGON MODEL; VOLTAMMOGRAM;

INTERFACES (MATERIALS);

EID: 0030573492     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/0022-0728(96)04622-0     Document Type: Article

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