Mechanical properties of thick, surface micromachined polysilicon films

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1996, Pages 343-348

  Kahn, H ^a   Stemmer, S ^a   Nandakumar, K ^a   Heuer, A H ^a   Mullen, R L ^a   Ballarini, R ^a   Huff, M A ^a  

^a CASE WESTERN RESERVE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRENGTH; ELASTIC MODULI; FRACTURE TOUGHNESS; MICROELECTRONIC PROCESSING; MICROELECTRONICS; MICROMACHINING; OXIDATION; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING FILMS; SILICA; SURFACE PHENOMENA;

FILM THICKNESS; MICROMECHANICAL TEST STRUCTURE; POLYCRYSTALLINE FILMS; POLYSILICON FILMS; SURFACE MICROMACHINED MICROELECTROMECHANICAL SYSTEMS; THERMAL OXIDATION;

MICROELECTROMECHANICAL DEVICES;

EID: 0029774305     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)