Return path inductance in measurements of package inductance matrixes

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 1, 1997, Pages 50-55

  Young, Brian ^a,b  

^a IEEE   (United States)

^b MOTOROLA INC   (United States)

Author keywords

Bandwidth; Inductance matrix; Partial inductance; Reference; Repeatability

Indexed keywords

ELECTRIC CURRENT MEASUREMENT; ELECTRON DEVICE TESTING; ELECTRONICS PACKAGING; INDUCTANCE MEASUREMENT; MATHEMATICAL TRANSFORMATIONS; MATRIX ALGEBRA;

MEASUREMENT RETURN PATH; PACKAGE INDUCTANCE MATRIXES; PARTIAL INDUCTANCE; RETURN PATH INDUCTANCE;

CIRCUIT THEORY;

EID: 0031077608     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.554526     Document Type: Article

References (7)

1. A. Nakamura, J. Mano, T. Nagata, H. Shimizu, M. Yagyu, K. Nishi, and K. Otsuka, "Handling of mutual inductance in simulation of simultaneous switching noise," in Proc. 44th Electronic Components. Technol. Conf., Washington, DC, May 1-4, 1994, pp. 663-668.
2. C.-T. Tsai, H. Andersen, and W.-Y. Yip, "Electrical characterization of bonding wires," in Proc. ISHM, 1994, pp. 479-484.
3. B. Young and A. Sparkman, "Measurement of package inductance and capacitance matrices," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 19, Feb. 1996.
4. JEDEC, "Guidelines for measurement of electronic package inductance and capacitance model parameters," committee ballot JC-15-93-106A, Dec. 28, 1993.
5. D. K. Cheng, Field and Wave Electromagnetics, 2nd ed. New York: Addison-Wesley, 1989, pp. 265-268.
6. A. E. Ruehli, "Inductance calculations in a complex integrated circuit environment," IBM J. Res. Develop., pp. 470-481, Sept. 1972.
7. L. Diaz-Olavarrieta, "Groundbounce in ASIC's: Model and test results," in Int. Symp. Electromag. Compat., Aug. 12-16, 1991, pp. 387-392.