A compact model for predicting the isolation of ports in a closed rectangular microchip package

IEEE Transactions on Microwave Theory and Techniques

Volumn 44, Issue 1, 1996, Pages 81-86

  Oison, Hilding M ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER WORKSTATIONS; ELECTRIC CURRENT DISTRIBUTION; ELECTRIC CURRENTS; ELECTRIC EXCITATION; ELECTRIC FIELDS; ELECTROMAGNETIC FIELDS; MATHEMATICAL MODELS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PERSONAL COMPUTERS;

COMMERCIAL ELECTROMAGNETIC ANALYSIS; CURRENT SOURCES; MICROCHIP PACKAGE; PORTS ISOLATION; TANGENTIAL FIELD;

ELECTRONICS PACKAGING;

EID: 0029774939     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.481388     Document Type: Article

References (10)

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