Relaxation of mechanical stress in polyimide films by softbaking

Thin Solid Films

Volumn 290-291, Issue , 1996, Pages 74-79

  Bhattacharya, P K ^a   Bhosale, K S ^b  

^a SOUTHERN UNIVERSITY   (United States)

^b LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

Mechanical stress; Relaxation of polyimide; Softbaking; Thermal effect

Indexed keywords

CRACK INITIATION; DELAMINATION; MATHEMATICAL MODELS; MAXWELL EQUATIONS; POLYIMIDES; STRESS RELAXATION; STRESSES; THERMAL EFFECTS; THIN FILMS; VISCOSITY MEASUREMENT;

SOFTBAKING;

DIELECTRIC FILMS;

EID: 0030415489     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(96)09188-2     Document Type: Article

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