TEM characterization of diffusion bonding of superplastic 8090 Al-Li alloy

Scripta Materialia

Volumn 34, Issue 4, 1996, Pages 617-623

  Urena A ^a   Gomez De Salazar J Ma ^a   Quinones J ^a   Martin J J ^a  

^a UNIVERSIDAD COMPLUTENSE DE MADRID   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHARACTERIZATION; DIFFUSION; GRAIN BOUNDARIES; INTERFACES (MATERIALS); METALLOGRAPHIC MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); SECONDARY ION MASS SPECTROMETRY; SUPERPLASTICITY; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM COPPER INTERLAYER; DIFFUSION BONDING TEST; LOW INTERFACE MOBILITY; METALLIC INTERLAYER; SOLID STATE DIFFUSION BONDING METHOD; SUPERPLASTIC ALUMINUM LITHIUM ALLOY;

ALUMINUM ALLOYS;

EID: 0030081430     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/1359-6462(95)00551-X     Document Type: Article

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