Micromachined thick permanent magnet arrays on silicon wafers

IEEE Transactions on Magnetics

Volumn 32, Issue 5 PART 2, 1996, Pages 5154-5156

  Liakopoulos, Trifon M ^a   Zhang, Wenjin ^a   Ahn, Chong H ^a  

^a University of Cincinnati   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COERCIVE FORCE; ELECTROPLATING; MAGNETIC ANISOTROPY; MAGNETIC THICK FILMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SILICON WAFERS; SUBSTRATES;

DEMAGNETIZATION EFFECT; ELECTRON BEAM EVAPORATOR; MAGNET ARRAY; MAGNETIC MICROELECTROCHEMICAL SYSTEMS;

PERMANENT MAGNETS;

EID: 0030245514     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/20.539521     Document Type: Article

References (7)

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2. B. Wagner, M. Kreutzer, and W. Benecke, "Permanent Magnet Micromotors on Silicon Substrate", IEEE/ASME Journal of Microelectromechanical Systems (MEMS), Vol. 2, No. 1, pp. 23-29, 1993.
3. C. H. Ahn and M. G. Allen, "A New Toroidal-Meander Type Integrated Inductor with Multilevel Meander Magnetic Core", IEEE Transactions on Magnetics, Vol. 30, No. 1, pp. 73-79, 1994.
4. T. M. Liakopoulos, W. Zhang, and C. H. Ahn, "Electroplated Thick CoNiMnP Permanent Magnet Arrays for Micromachined Magnetic Device Applications", Proc. IEEE Microelectromechanical Systems (MEMS) Workshop, pp. 79-84, 1996.
5. K. J. Strnat, "Modern Permanent Magnets for Application in Electro-Technology", Proc. IEEE, Vol. 78, No. 6, pp. 923-946, 1990.
6. T. Osaka, N. Kasai, I. Koiwa, F. Goto, and Y. Sugunuma, "A Preparation of Perpendicular Magnetic Recording Media by an Electroless Plating Method", J. Electrochem. Soc., Vol. 130, pp. 568-571, 1983.
7. J. Horkans, D. J. Seagle, and I. H. Chang, "Electroplated Magnetic Media With Vertical Anisotropy", J. Electrochem. Soc. Vol. 173, No. &, pp. 2056-2061, 1990.