Simulating the Dynamic Electrothermal Behavior of Power Electronic Circuits and Systems

IEEE Transactions on Power Electronics

Volumn 8, Issue 4, 1993, Pages 376-385

  Hefner, Allen R ^a   Blackburn, David L ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CURRENTS; HEAT LOSSES; HEAT SINKS; MICROPROCESSOR CHIPS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE STRUCTURES; TEMPERATURE DISTRIBUTION; THERMAL DIFFUSION IN SOLIDS; THERMODYNAMIC PROPERTIES;

DYNAMIC ELECTROTHERMAL BEHAVIOR; POWER ELECTRONIC CIRCUITS AND SYSTEMS; THERMAL NETWORKS;

SEMICONDUCTOR DEVICES;

EID: 0027681286     PISSN: 08858993     EISSN: 19410107     Source Type: Journal    
DOI: 10.1109/63.261007     Document Type: Article

References (12)

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