Simulation and interpretation of wetting balance tests using the surface evolver

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 3, 1996, Pages 134-141

  Whalley, D C ^a   Conway, P P ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; FORCE MEASUREMENT; PRINTED CIRCUIT BOARDS; SENSITIVITY ANALYSIS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; SURFACE PROPERTIES; SURFACE TENSION; WETTING;

GLOBULE BLOCK TEST; GLOBULE WETTING BALANCE; PROBABILITY OF PROCESS DEFECTS; SOLDER BATH; SURFACE EVOLVER; WETTING ANGLE; WETTING BALANCE TESTS;

SOLDERING;

EID: 0030231118     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792143     Document Type: Article

References (17)

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