Experimental study on physical properties of compression molded SMC parts under plane strain condition

Composite Structures

Volumn 35, Issue 2, 1996, Pages 131-141

  Kim, Ki Taek ^a   Im, Yong Taek ^b  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE PROPERTIES; COMPOSITES; COMPRESSION; SMC;

BENDING STRENGTH; COMPRESSION MOLDING; COMPRESSION TESTING; PHYSICAL PROPERTIES; RHEOLOGY; SCANNING ELECTRON MICROSCOPY; SHEET MOLDING COMPOUNDS; STRAIN; SURFACE ROUGHNESS; TENSILE PROPERTIES; TENSILE TESTING; THERMAL EFFECTS;

COMPRESSION MOLDED SHEET MOLDING COMPOUND PARTS; FLOW RESISTANCE; MOLD CLOSING SPEED; MOLD GEOMETRY; MOLD TEMPERATURE; MOLDING CONDITIONS; MOLDING VARIABLES EFFECT; PLANE STRAIN CONDITIONS; POINT BENDING TEST;

COMPOSITE STRUCTURES;

EID: 0030169141     PISSN: 02638223     EISSN: None     Source Type: Journal    
DOI: 10.1016/0263-8223(95)00158-1     Document Type: Article

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